| Equipment |
Model |
Used for |
Remark |
| FUJI Coordinator |
DT2 |
PCB X,Y |
Reading PCB X,Y |
| Panasonic Pick up and Place machine X 2 |
CM88C |
Up to 0402 |
600,000chips/day |
| FUJI Pick up and Place machine X 2 |
CP6 |
Up to 0402 |
500,000chips/day |
| FUJI Pick up and Place machine X 3 |
CP43 |
Up to 0603 |
400,000chips/day |
| YAMAHA X 2 |
YVL88 |
SOP¡«BGA |
|
| PANASONIC Solder paste printing |
SPP-A |
0.3mm PITCH |
|
| HTI Solder paste printing X 3 |
|
0.3mm PITCH |
|
| FUJIGlue depansor X 3 |
GL |
Glue dots |
3 |
| BTUReflow X 3 |
VIP 70 |
|
14 temperature area |
| WJWave soldering |
WJ-35RHA |
DIP |
Through hole |
| Temp & humidity Keeper |
|
Chips |
|
| Insertion Line X 2 |
|
DIP |
|
| Touch up and assembly X 2 |
|
Products |
|
| Dip solder oven X 2 |
|
DIP |
|
| Lead cutter X 2 |
KA-66 |
DIP |
|
| KOKI dual wave solder X 1 |
TAF-350 |
DIP |
|
| Ultrasonic Cleaner X 1 |
|
PCB assembly |
|
| ICT X 1 |
OKANO |
Circuit testing |
|
| SANYO Temperature environment Tester |
CFCFREE |
Products |
|
| Solder pasteconglutinate Tester |
PCU-201 |
Solder paste |
MALCOM |
| MALCOM Temperature Tester |
RC-8 |
Reflow |
|
| SMDCap/Res/IndTester |
|
Testing |
SMD Components |
| DIP Cap/Res/Ind/TransistorTester |
|
Testing |
DIPComponents |
